Embedded World 2026

SPARK Microsystems invites you to meet with us at Embedded World (March 10–12, Nuremberg) to explore how our Low Energy UWB (LE-UWB) wireless technology is enabling the next generation of IoT devices. 

Our LE-UWB solutions deliver ultra-low latency, ultra-low power consumption, and high data throughput, while maintaining robust and reliable connectivity even in dense RF environments where Bluetooth® LE, Wi-Fi, and other legacy wireless technologies are unable to meet the requirements. 

At our booth, we will be showcasing live demonstrations and customer products across AI wearables, positioning, gaming, and audio applications, including: 

• Next-generation uncompressed, lossless audio and AI wearables with <3 ms latency and <3 µs synchronization 

• True 8K HID peripherals (mouse, keyboard, headset, gaming controller) with near-zero 130 µs latency and highly stable and responsive links 

• Proximity and presence sensing solutions with high sampling rate and over 5-year battery with beaconing and Time-of-Flight (ToF) 

Visit us in Hall 3A, Booth 3A-438, exhibiting alongside our partner Seltech.

Reach out to us now at EMEA_sales@sparkmicro.com to reserve your spot. We look forward to seeing you.